Invention Grant
- Patent Title: Solid-state image pickup unit, method of manufacturing the same, and electronic apparatus
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Application No.: US14780640Application Date: 2014-03-27
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Publication No.: US10910424B2Publication Date: 2021-02-02
- Inventor: Keisuke Hatano
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JP2013-078831 20130404
- International Application: PCT/JP2014/001805 WO 20140327
- International Announcement: WO2014/162705 WO 20141009
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L27/28 ; H01L27/30
Abstract:
A solid-state image pickup unit includes: a first member including a photoelectric conversion section; and a second member including a reflective plate with a concave surface section, the second member being bonded to a surface opposite to a light incident surface of the first member to allow the concave surface section of the reflective plate to face the photoelectric conversion section.
Public/Granted literature
- US20160043125A1 SOLID-STATE IMAGE PICKUP UNIT, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS Public/Granted day:2016-02-11
Information query
IPC分类:
