Invention Grant
- Patent Title: Imaging device with opening parts for power and signal paths
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Application No.: US16306275Application Date: 2017-02-22
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Publication No.: US10910430B2Publication Date: 2021-02-02
- Inventor: Katsuhiko Hanzawa
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2016-114265 20160608
- International Application: PCT/JP2017/006540 WO 20170222
- International Announcement: WO2017/212693 WO 20171214
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/378 ; H04N5/369 ; H04N5/374 ; H04N5/3745

Abstract:
A plurality of circuits are each connected with one of a plurality of power supply lines disposed in a direction perpendicular to a predetermined direction. A signal processing part processes a pixel signal that is output via a signal line commonly connected with a predetermined number of adjacent pixel circuits in the predetermined direction from among a plurality of pixel circuits. A power path opening/closing part opens and closes a path between each of the plurality of power supply lines and a power supply. A common path opening/closing part opens and closes a path between each of the plurality of power supply lines and the signal line.
Public/Granted literature
- US20190252448A1 SOLID-STATE IMAGING DEVICE, IMAGING APPARATUS, AND METHOD OF CONTROLLING SOLID-STATE IMAGING DEVICE Public/Granted day:2019-08-15
Information query
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