Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US16255118Application Date: 2019-01-23
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Publication No.: US10910493B2Publication Date: 2021-02-02
- Inventor: Choul Joo Ko
- Applicant: DB HITEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: DB HITEK CO., LTD.
- Current Assignee: DB HITEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Patterson Thuente Pedersen, P.A.
- Priority: KR10-2018-0008940 20180124
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/06 ; H01L29/423 ; H01L29/10 ; H01L29/08

Abstract:
A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes a first body region disposed in a substrate and having a first conductivity type, a second body region disposed on the first body region and having the first conductivity type and a portion protruding in a channel length direction, a source region disposed in the second body region and having a second conductivity type, a drain region spaced apart from the protruding portion of the second body region in the channel length direction and having the second conductivity type, a well region configured to electrically connect the protruding portion of the second body region and the drain region and having the second conductivity type, and a gate structure disposed on the protruding portion of the second body region.
Public/Granted literature
- US20190229213A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-07-25
Information query
IPC分类: