According to one embodiment, the light guide plate has a first major surface, a second major surface, a side surface, and a recess. The recess is provided in the second major surface. The fluorescent layer is provided in the recess. The light-emitting element is bonded to the fluorescent layer and includes an electrode on a surface of the light-emitting element on a side opposite to a surface of the light-emitting element bonded to the fluorescent layer. The module side surface includes at least a portion of the side surface of the light guide plate. The first interconnect is provided along the second major surface and connected to the electrode of the light-emitting element. The second interconnect is provided on the module side surface and connected to the first interconnect.