Invention Grant
- Patent Title: Light emitting device, resin-attached lead frame, and methods of manufacturing the same
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Application No.: US16392106Application Date: 2019-04-23
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Publication No.: US10910537B2Publication Date: 2021-02-02
- Inventor: Yukitoshi Marutani
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2018-082516 20180423
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L23/495 ; H01L21/48 ; H01L33/48 ; H01L33/52

Abstract:
A light emitting device includes: a base body including two conductive members, a resin body, and a fiber member placed inside the resin body, and a light-emitting element. The resin body includes an isolation section located between the two conductive members, and includes a pair of sandwiching portions sandwiching the isolation section. The fiber member has a length which is greater than a distance between the two conductive members, and is located at least in an adjoining region of at least one of the pair of sandwiching portions, the adjoining region adjoining the isolation section. In the adjoining region, the fiber member extends in a direction which is non-orthogonal to a direction in which that the pair of sandwiching portions extend.
Public/Granted literature
- US20190326492A1 LIGHT EMITTING DEVICE, RESIN-ATTACHED LEAD FRAME, AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2019-10-24
Information query
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