Invention Grant
- Patent Title: Light emitting device and manufacturing method thereof
-
Application No.: US16653116Application Date: 2019-10-15
-
Publication No.: US10910539B2Publication Date: 2021-02-02
- Inventor: Keiichi Maki
- Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
- Applicant Address: JP Asahikawa
- Assignee: TOSHIBA HOKUTO ELECTRONICS CORPORATION
- Current Assignee: TOSHIBA HOKUTO ELECTRONICS CORPORATION
- Current Assignee Address: JP Asahikawa
- Agency: Burr & Brown, PLLC
- Priority: JP2013-249453 20131202,JP2013-249454 20131202
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L25/075 ; H01L23/00 ; H01L33/56 ; H01L33/52

Abstract:
A light emitting device includes a first light transmissive supportive substrate having a first light transmissive insulator and a conductive circuitry layer provided on a surface of the first light transmissive insulator, a second light transmissive supportive substrate having a second light transmissive insulator and disposed in such a way that a surface of the second light transmissive insulator faces the conductive circuitry layer and so as to have a predetermined gap from the first light transmissive supportive substrate, a light emitting diode having a main body, and first and second electrodes provided on a surface of the main body and electrically connected to the conductive circuitry layer via a conductive bump, and laid out between the first and second light transmissive supportive substrates, and a third light transmissive insulator embedded in a space between the first light transmissive supportive substrate and the second light transmissive supportive substrate.
Public/Granted literature
- US20200044130A1 LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-02-06
Information query
IPC分类: