Invention Grant
- Patent Title: Ultrasonic device, ultrasonic probe, ultrasonic apparatus, and ultrasonic device manufacturing method
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Application No.: US15428479Application Date: 2017-02-09
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Publication No.: US10910548B2Publication Date: 2021-02-02
- Inventor: Chikara Kojima
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Hamess, Dickey & Pierce, P.L.C.
- Priority: JP2016-031393 20160222
- Main IPC: A61B8/14
- IPC: A61B8/14 ; H01L41/053 ; H01L41/00 ; H01L41/047 ; G01S7/52 ; A61B8/00 ; B06B1/06

Abstract:
An ultrasonic device includes: an element substrate including an ultrasonic transducer and a first connection electrode connected to the ultrasonic transducer; a reinforcing plate that is bonded to the element substrate to reinforce the element substrate; and a second connection electrode provided on the reinforcing plate. The first and second connection electrodes are connected to each other in a bonding portion between the element substrate and the reinforcing plate.
Public/Granted literature
- US20170244022A1 ULTRASONIC DEVICE, ULTRASONIC PROBE, ULTRASONIC APPARATUS, AND ULTRASONIC DEVICE MANUFACTURING METHOD Public/Granted day:2017-08-24
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