Invention Grant
- Patent Title: Radar sensor housing design
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Application No.: US16248821Application Date: 2019-01-16
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Publication No.: US10910706B2Publication Date: 2021-02-02
- Inventor: Chih-Ming Hung , Yu Chun Lu , Yen-Ju Lu , ChiaYu Lin
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsinchu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Han IP PLLC
- Agent Andy M. Han
- Main IPC: H01Q1/42
- IPC: H01Q1/42 ; H05K1/02 ; G01S13/93 ; G01S7/02 ; G01S13/931 ; H01Q1/32

Abstract:
Various examples pertaining to a sensor housing design for millimeter wave (mmWave) sensors are described. A sensor housing may include a radar sensor, a printed circuit board (PCB), a radome and a PCB holder. The radar sensor may be capable of emitting a radio wave. The PCB may have a first side and a second side opposite the first side with the radar sensor mounted on the first side thereof to form a PCB assembly (PCBA). The radome may include a cavity in which the PCBA is disposed. The PCB holder may be disposed along a circumference of an inner wall of the radome, and the PCB holder may be configured to hold the PCBA such that a distance between an inner surface of the radome and a side of the radar sensor facing the inner surface of the radome is proportional to half wavelength of the radio wave.
Public/Granted literature
- US20190229410A1 Radar Sensor Housing Design Public/Granted day:2019-07-25
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