Invention Grant
- Patent Title: Circuit module and method for manufacturing circuit module
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Application No.: US16836990Application Date: 2020-04-01
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Publication No.: US10910783B2Publication Date: 2021-02-02
- Inventor: Mizuki Shirai , Toshiharu Shimizu , Hiroki Kondo
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2019-082138 20190423
- Main IPC: H01R12/53
- IPC: H01R12/53 ; H01R43/02 ; H05K1/11 ; H05K3/32 ; H01R9/05 ; H05K1/02
Abstract:
An inner conductor of a coaxial cable is electrically connected to a circuit body of a circuit board by means of solder. An outer conductor is electrically connected to a ground body by means of the solder. The inner conductor has a connecting portion connected to the circuit body and a non-exposed portion inside a sheath. A thickness of the connecting portion is equal to or less than 35% of a thickness of the non-exposed portion, and the cross-sectional area of the connecting portion is the same as the cross-sectional area of the non-exposed portion.
Public/Granted literature
- US20200343678A1 CIRCUIT MODULE AND METHOD FOR MANUFACTURING CIRCUIT MODULE Public/Granted day:2020-10-29
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