Invention Grant
- Patent Title: Component mounting device
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Application No.: US15571923Application Date: 2015-06-19
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Publication No.: US10912241B2Publication Date: 2021-02-02
- Inventor: Kazushi Takama
- Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Applicant Address: JP Iwata
- Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee Address: JP Iwata
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2015/067707 WO 20150619
- International Announcement: WO2016/203639 WO 20161222
- Main IPC: H05K13/08
- IPC: H05K13/08 ; H05K13/04 ; H05K3/30

Abstract:
A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging unit capable of imaging the mounting position from a plurality of fields of view, imaging directions of which are different from each other, and a controller that selects a success or failure determination field of view used for success or failure determination of whether or not the component has been mounted at the mounting position from the plurality of fields of view according to a state of a shield around the mounting position.
Public/Granted literature
- US20180098468A1 COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING DETERMINATION METHOD FOR COMPONENT MOUNTING DEVICE Public/Granted day:2018-04-05
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