A method for manufacturing an electronic component, includes: a step of temporarily fixing onto a support body a workpiece to become a member constituting an electronic component, via a film-like temporary fixing material; a step of processing the workpiece which is temporarily fixed onto the support body; and a step of separating the processed workpiece from the support body and the film-like temporary fixing material, and the film-like temporary fixing material contains an (meth)acrylic copolymer (A) having a not unevenly distributed reactive functional group.