Invention Grant
- Patent Title: Three-dimensional shaping apparatus and three-dimensional shaping system
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Application No.: US15345638Application Date: 2016-11-08
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Publication No.: US10913259B2Publication Date: 2021-02-09
- Inventor: Yasukazu Ono
- Applicant: RICOH COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: RICOH COMPANY, LTD.
- Current Assignee: RICOH COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, LLP.
- Priority: JP2015-227939 20151120,JP2016-064116 20160328
- Main IPC: B33Y50/02
- IPC: B33Y50/02 ; B33Y30/00 ; B33Y40/00 ; B29C64/165 ; B29C64/357 ; B29C64/35 ; B29C64/393

Abstract:
A three-dimensional shaping apparatus includes: a shaping chamber configured to hold powder; a leveler configured to move from a first position to a second position in a first direction on a top surface of the powder held in the shaping chamber to flatten the top surface of the powder; an ejector configured to eject a shaping liquid to the flattened top surface of the powder held in the shaping chamber; and a suction mechanism including a suction inlet arranged close to the second position of the shaping chamber.
Public/Granted literature
- US20170144374A1 THREE-DIMENSIONAL SHAPING APPARATUS AND THREE-DIMENSIONAL SHAPING SYSTEM Public/Granted day:2017-05-25
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