Invention Grant
- Patent Title: Structure forming method, structure forming apparatus, structure forming program and structure forming processing medium
-
Application No.: US15777346Application Date: 2016-10-28
-
Publication No.: US10913291B2Publication Date: 2021-02-09
- Inventor: Fusao Nishiura
- Applicant: CASIO COMPUTER CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Scully Scott Murphy & Presser
- Priority: JP2015-225481 20151118,JP2016-104772 20160526
- International Application: PCT/JP2016/082898 WO 20161028
- International Announcement: WO2017/086191 WO 20170526
- Main IPC: B41J11/00
- IPC: B41J11/00 ; B41J2/01 ; B41J3/407 ; B41M3/06 ; B41M7/00

Abstract:
A structure forming method of present invention includes a first step including forming a first pattern serving as a fine pattern using an electromagnetic wave thermal conversion material on a first surface, on the side on which an expansion layer which expands by heating is provided, of a medium including the expansion layer and then irradiating an electromagnetic wave toward the electromagnetic wave thermal conversion material to expand a portion, corresponding to the first pattern, of the expansion layer, and a second step including forming a second pattern including a coarser pattern than the first pattern using an electromagnetic wave thermal conversion material on a second surface, on the opposite side to the side on which the expansion layer is provided, of the medium and then irradiating an electromagnetic wave toward the electromagnetic wave thermal conversion material to expand a portion, corresponding to the second pattern, of the expansion layer.
Public/Granted literature
Information query
IPC分类: