Invention Grant
- Patent Title: Array-type electrode, digital printing mold and method for manufacturing array-type electrode
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Application No.: US15854247Application Date: 2017-12-26
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Publication No.: US10913301B2Publication Date: 2021-02-09
- Inventor: Wei-Yuan Chen , Yu-Ming Wang , Sheng-Yu Lin , Yi-Wei Lin
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsin-Chu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsin-Chu
- Agency: WPAT, PC
- Priority: TW106138499A 20171107
- Main IPC: B32B3/10
- IPC: B32B3/10 ; B41M5/00 ; H05K3/10 ; B32B7/04 ; B41M7/00 ; B41M99/00 ; H05K3/42 ; B32B15/04

Abstract:
An array-type electrode, which may include a substrate, an isolating layer, an electrode and a micro-structure layer. The isolating layer may be disposed on one side of the substrate. The first part of the electrode may be disposed on one side of the substrate and covered by the isolating layer; the second part of the electrode penetrates through the substrate; the third part of the electrode may be disposed on the other side of the substrate; the first part may be connected to the third part via the second part. The micro-structure layer may be disposed on the isolating layer.
Public/Granted literature
- US20190135010A1 ARRAY-TYPE ELECTRODE, DIGITAL PRINTING MOLD AND METHOD FOR MANUFACTURING ARRAY-TYPE ELECTRODE Public/Granted day:2019-05-09
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