An integrated heat shield which encloses a frame structure comprises a leading edge component, a left side component, a right side component, an optionally top component, an optional bottom component and an optional trailing edge subassembly, wherein the leading edge component and the left and right side components are directly, integrally co-cured on the frame structure while in a B-stage. The leading edge component and the left and right side components are shingle laminated to form ply angles to air flow. The leading edge component and the side components are scarf-jointed or step-jointed. The side components and trailing edge subassembly are also scarf jointed or step-jointed. The co-curing as well as the scarf or step joints makes the heat shield an integrated assembly. A method of manufacturing the integrated heat shield is further introduced.