Invention Grant
- Patent Title: Temperature controlled case and temperature controlled package including the same
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Application No.: US16192651Application Date: 2018-11-15
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Publication No.: US10913591B2Publication Date: 2021-02-09
- Inventor: Hyun Cheol Kim , Jin Ho Yoon , Young Soo Jung , Seung Yeon Lee
- Applicant: OCI Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: OCI Co., Ltd.
- Current Assignee: OCI Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Seed IP Law Group LLP
- Priority: KR10-2017-0152467 20171115
- Main IPC: B65D81/38
- IPC: B65D81/38 ; B65D81/18 ; B29D99/00

Abstract:
Disclosed herein is a temperature controlled case. The temperature controlled case includes a base and a stepped portion protruding from an upper surface of the base, wherein the stepped portion has a rectangular shape having a major axis and a minor axis in top plan view, a height of the base is the same as a maximum height of the stepped portion protruding from the base, and maximum distances from an edge of the base to the stepped portion in the major axis and minor axis directions are the same as the height of the base or the maximum height of the stepped portion.
Public/Granted literature
- US20190144193A1 TEMPERATURE CONTROLLED CASE AND TEMPERATURE CONTROLLED PACKAGE INCLUDING THE SAME Public/Granted day:2019-05-16
Information query