Invention Grant
- Patent Title: Packaging a sealed cavity in an electronic device
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Application No.: US16813967Application Date: 2020-03-10
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Publication No.: US10913654B2Publication Date: 2021-02-09
- Inventor: Adam Joseph Fruehling , Juan Alejandro Herbsommer , Simon Joshua Jacobs , Benjamin Stassen Cook , James F. Hallas , Randy Long
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Ray A. King; Charles A. Brill; Frank D. Cimino
- Main IPC: B81B7/00
- IPC: B81B7/00 ; H03L7/26 ; G01L7/08 ; G04F5/14 ; G01M3/32 ; G01L9/00
Abstract:
An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.
Public/Granted literature
- US20200207611A1 PACKAGING A SEALED CAVITY IN AN ELECTRONIC DEVICE Public/Granted day:2020-07-02
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