Invention Grant
- Patent Title: Epoxy resin, epoxy resin composition, cured product and electrical or electronic component
-
Application No.: US15910707Application Date: 2018-03-02
-
Publication No.: US10913818B2Publication Date: 2021-02-09
- Inventor: Kazumasa Oota
- Applicant: MITSUBISHI CHEMICAL CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI CHEMICAL CORPORATION
- Current Assignee: MITSUBISHI CHEMICAL CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Leason Ellis LLP
- Priority: JP2015-173911 20150903,JP2015-174043 20150903
- Main IPC: H01L23/29
- IPC: H01L23/29 ; C08G59/24 ; C08L63/00 ; C09J163/00 ; C07D301/28 ; C07D303/27 ; C07D303/28 ; C08G59/06 ; C08G59/62 ; C08G59/68 ; C08G59/40
Abstract:
The present invention relates to a tetramethylbiphenol epoxy resin represented by the following formula (1), which is an epoxy resin having excellent solvent solubility, a small hydrolyzable chlorine amount and further an appropriate melt viscosity and being effectively applicable, to a semiconductor sealing material and electrical or electronic components such as laminate sheet: wherein n represents an integer of 0 to 10.
Public/Granted literature
- US20180215862A1 EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT AND ELECTRICAL OR ELECTRONIC COMPONENT Public/Granted day:2018-08-02
Information query
IPC分类:
