Invention Grant
- Patent Title: Resin composition for semiconductor package, and prepreg and metal clad laminate using the same
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Application No.: US16487047Application Date: 2018-04-11
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Publication No.: US10913849B2Publication Date: 2021-02-09
- Inventor: Chang Bo Shim , Hee Yong Shim , Hyun Sung Min , Hwa Yeon Moon , Seung Hyun Song , Yong Seon Hwang
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2017-0060152 20170515
- International Application: PCT/KR2018/004248 WO 20180411
- International Announcement: WO2018/212459 WO 20181122
- Main IPC: C08L71/12
- IPC: C08L71/12 ; C08J5/24 ; C08L9/06 ; C08L23/20 ; C08L83/04 ; C08K3/013 ; C08K5/08
Abstract:
A resin composition, optionally for a semiconductor package, and a prepreg and a metal clad laminate using the same are provided. The resin composition according to the present invention may exhibit excellent flowability although being packed with a high content of an inorganic filler, and may provide a prepreg and a metal clad laminate having excellent adhesive strength for a metal foil, and low relative permittivity and a low dissipation factor.
Public/Granted literature
- US20200231804A1 RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, AND PREPREG AND METAL CLAD LAMINATE USING THE SAME Public/Granted day:2020-07-23
Information query
IPC分类:
