Invention Grant
- Patent Title: Method and solution for forming interconnects
-
Application No.: US16586483Application Date: 2019-09-27
-
Publication No.: US10914008B2Publication Date: 2021-02-09
- Inventor: Henricus Philipsen
- Applicant: IMEC VZW
- Applicant Address: BE Leuven
- Assignee: IMEC VZW
- Current Assignee: IMEC VZW
- Current Assignee Address: BE Leuven
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Priority: EP18197361 20180927
- Main IPC: C23C18/44
- IPC: C23C18/44 ; H01L23/532 ; H01L21/768 ; C23C18/54 ; H01L21/288 ; H05K3/18 ; H01L21/285 ; H05K3/46
Abstract:
An oxygen-free or oxygen-poor solution for the electroless deposition of a platinum group metal is described. The solution includes a ruthenium (II) amine complex having a first oxidation potential, and a platinum group metal compound having a reduction potential larger than the opposite of the oxidation potential of the ruthenium (II) amine complex.
Information query
IPC分类:
