An optical image capturing module includes a lens assembly and a circuit assembly including a carrier board, a circuit substrate and an image sensing component. The circuit substrate disposed on the carrier hoard has a hole and multiple circuit contacts. The image sensing component disposed on the carrier board is located in the hole, and has a sensing surface and multiple image contacts. Each image contact is electrically connected to circuit contacts via signal transmission elements. The lens assembly includes a lens group and a lens base disposed on the carrier board or the circuit substrate. The lens base has a receiving hole penetrating through two ends thereof, thereby the lens base is hollow. The image sensing component directly faces the receiving hole. The lens group includes at least two lenses having refractive power, and is disposed on the lens base and is located in the receiving hole.