Invention Grant
- Patent Title: Monomer, polymer, resist composition, and patterning process
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Application No.: US16121970Application Date: 2018-09-05
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Publication No.: US10915021B2Publication Date: 2021-02-09
- Inventor: Masahiro Fukushima , Koji Hasegawa , Jun Hatakeyama
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2017-175900 20170913
- Main IPC: G03F7/004
- IPC: G03F7/004 ; C08F12/16 ; G03F7/033 ; G03F7/42 ; C08F2/38 ; C08F220/18 ; C08F228/02 ; C08F12/24 ; C07C43/225 ; C08F12/22 ; C08F12/32 ; C08F212/32 ; G03F7/039 ; C09D125/18 ; C08F212/14 ; C07C43/247 ; C07C39/373 ; C08F2/50

Abstract:
A monomer having formula (A) is provided. RA is H, methyl or trifluoromethyl, X1 is a single bond, ether, ester or amide bond, Ra is a C1-C20 monovalent hydrocarbon group, Rb is H or an acid labile group, X is halogen, n is an integer of 1 to 4, m is an integer of 0 to 3, and 1≤n+m≤4. A resist composition comprising a polymer derived from the monomer has a high sensitivity to high-energy radiation, especially EUV.
Public/Granted literature
- US20190079399A1 MONOMER, POLYMER, RESIST COMPOSITION, AND PATTERNING PROCESS Public/Granted day:2019-03-14
Information query
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