Invention Grant
- Patent Title: Sensor-to-sensor matching methods for chamber matching
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Application No.: US16538313Application Date: 2019-08-12
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Publication No.: US10916411B2Publication Date: 2021-02-09
- Inventor: Jun Shinagawa
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
Embodiments are described herein for sensor-to-sensor matching methods for chamber matching across multiple plasma processing chambers. For disclosed embodiments, a baseline signature in a first processing chamber is compared to a signature generated in a second processing chamber in order to adjust and match sensor display values for the second processing chamber. The baseline signature is determined using a golden reference sensor disposed within the first processing chamber and plasma sensors monitoring a baseline plasma. The signature of the plasma is determined using the golden reference sensor disposed within the second processing chamber and plasma sensors monitoring the plasma. Differences are determined between the baseline signature and the signature, and a display value for the plasma sensors for the second processing chamber is adjusted based on the differences to provide chamber matching with the first processing chamber. The golden reference sensor can be a wafer with embedded sensors.
Public/Granted literature
- US20200051787A1 SENSOR-TO-SENSOR MATCHING METHODS FOR CHAMBER MATCHING Public/Granted day:2020-02-13
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