Invention Grant
- Patent Title: Package of integrated circuits having a light-to-heat-conversion coating material
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Application No.: US16204065Application Date: 2018-11-29
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Publication No.: US10916450B2Publication Date: 2021-02-09
- Inventor: Hsien-Ju Tsou , Chih-Wei Wu , Pu Wang , Szu-Wei Lu , Ying-Ching Shih , Jing-Cheng Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/48 ; H01L23/00 ; H01L23/31 ; H01L23/538 ; H01L25/10 ; H01L25/00 ; H01L21/683 ; H01L23/498
Abstract:
A method includes forming a release film over a carrier, forming a metal post on the release film, encapsulating the metal post in an encapsulating material, performing a planarization on the encapsulating material to expose the metal post, forming a redistribution structure over the encapsulating material and the metal post, decomposing a first portion of the release film to separate a second portion of the release film from the carrier, and forming an opening in the release film to expose the metal post.
Public/Granted literature
- US20190096700A1 Method of Manufacturing a Release Film as Isolation Film in Package Public/Granted day:2019-03-28
Information query
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