Invention Grant
- Patent Title: Wafer drying equipment and method thereof
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Application No.: US16232039Application Date: 2018-12-25
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Publication No.: US10916452B2Publication Date: 2021-02-09
- Inventor: Feng-Ju Tsai , Shyue-Ru Doong
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: CKC & Partners Co., LLC
- Main IPC: H01L21/67
- IPC: H01L21/67 ; F26B3/347

Abstract:
A wafer drying equipment includes a base, a casing and a microwave generator. The base is configured to support a wafer. The casing forms a chamber with the base. The chamber is configured to accommodate the wafer. The casing has an exhaust vent away from the base. The microwave generator is disposed on the casing and is configured to emit a microwave to the chamber.
Public/Granted literature
- US20200176277A1 WAFER DRYING EQUIPMENT AND METHOD THEREOF Public/Granted day:2020-06-04
Information query
IPC分类: