Invention Grant
- Patent Title: Heating device and semiconductor manufacturing apparatus
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Application No.: US15678296Application Date: 2017-08-16
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Publication No.: US10916457B2Publication Date: 2021-02-09
- Inventor: Masakazu Adachi
- Applicant: NISSIN ION EQUIPMENT CO., LTD.
- Applicant Address: JP Koka
- Assignee: NISSIN ION EQUIPMENT CO., LTD.
- Current Assignee: NISSIN ION EQUIPMENT CO., LTD.
- Current Assignee Address: JP Koka
- Agency: Sughrue Mion, PLLC
- Priority: JP2016-212481 20161031,JP2017-060206 20170324
- Main IPC: H05B3/68
- IPC: H05B3/68 ; H01L21/67 ; H01L21/683 ; H01L21/677 ; H01L21/687

Abstract:
A heating device is provided. The heating device includes a conveyance member that conveys a substrate between a heating position and a non-heating position, a support member that is provided on the conveyance member and that supports the substrate, a heater provided at the heating position and operable to heat a first surface of the substrate, and a heat reflecting plate attached to the conveyance member in facing relation to a second surface of the substrate opposite to the first surface.
Public/Granted literature
- US20180122661A1 HEATING DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS Public/Granted day:2018-05-03
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