Invention Grant
- Patent Title: Modified dielectric fill between the contacts of field-effect transistors
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Application No.: US16290178Application Date: 2019-03-01
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Publication No.: US10916470B2Publication Date: 2021-02-09
- Inventor: Vimal K. Kamineni , Ruilong Xie , Kangguo Cheng , Adra V. Carr
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Thompson Hine LLP
- Agent Francois Pagette
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/768 ; H01L23/532 ; H01L21/8234 ; H01L29/78

Abstract:
Structures that include a field effect-transistor and methods of forming a structure that includes a field-effect transistor. A first field-effect transistor includes a first source/drain region, and a second field-effect transistor includes a second source/drain region. A first contact is arranged over the first source/drain region, and a second contact is arranged over the second source/drain region. A portion of a dielectric layer, which is composed of a low-k dielectric material, is laterally arranged between the first contact and the second contact.
Public/Granted literature
- US20200279768A1 MODIFIED DIELECTRIC FILL BETWEEN THE CONTACTS OF FIELD-EFFECT TRANSISTORS Public/Granted day:2020-09-03
Information query
IPC分类: