Invention Grant
- Patent Title: Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same
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Application No.: US16356365Application Date: 2019-03-18
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Publication No.: US10916472B2Publication Date: 2021-02-09
- Inventor: Robert Clark , Jeffrey Smith , Kandabara Tapily , Angelique Raley , Qiang Zhao
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/768 ; H01L21/67 ; H01L21/677 ; H01L21/02 ; H01L21/285 ; H01L21/311 ; G05B13/02 ; G05B19/418 ; C23C14/24 ; C23C14/34 ; H01J37/32
Abstract:
This disclosure relates to a high volume manufacturing system for processing and measuring workpieces in a semiconductor processing sequence without leaving the system's controlled environment (e.g., sub-atmospheric pressure). The system includes an active interdiction control system to implement corrective processing within the system when a non-conformity is detected. The corrective processing can include a remedial process sequence to correct the non-conformity or compensate for the non-conformity during subsequent process. The non-conformity may be associated with fabrication measurement data, process parameter data, and/or platform performance data.
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Information query
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