Invention Grant
- Patent Title: Semiconductor devices with various line widths and method of manufacturing the same
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Application No.: US16901484Application Date: 2020-06-15
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Publication No.: US10916476B2Publication Date: 2021-02-09
- Inventor: Je-min Yoo , Sang-deok Kwon , Yuri Masuoka
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2018-0096127 20180817
- Main IPC: H01L21/82
- IPC: H01L21/82 ; H01L21/32 ; H01L21/8234 ; H01L29/66

Abstract:
Provided are semiconductor devices having various line widths and a method of manufacturing the semiconductor device. The semiconductor device includes: a substrate including a first region and a second region, a plurality of first gate lines extending in a first direction in the first region and each having a first width in a second; a plurality of second gate lines extending in the first direction in the second region and each having a second width that is different from the first width in the second direction and a pitch that is the same as a pitch of the plurality of first gate lines; a spacer layer covering opposite side walls of each of the plurality of first gate lines and each of the plurality of second gate lines; and a first base layer arranged between the substrate and the spacer layer in the first region.
Public/Granted literature
- US20200312720A1 SEMICONDUCTOR DEVICES WITH VARIOUS LINE WIDTHS AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-10-01
Information query
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