Invention Grant
- Patent Title: High bandwidth memory (HBM) bandwidth aggregation switch
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Application No.: US15616004Application Date: 2017-06-07
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Publication No.: US10916516B2Publication Date: 2021-02-09
- Inventor: Martin Newman , Sagheer Ahmad
- Applicant: Xilinx, Inc.
- Applicant Address: US CA San Jose
- Assignee: Xilinx, Inc.
- Current Assignee: Xilinx, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; G06F3/06 ; G06F12/0802 ; G06F13/16 ; G06F13/20 ; H04L12/933 ; G11C5/06 ; G11C8/18 ; G06F13/42 ; G06F13/40 ; H01L23/538

Abstract:
Methods and apparatus are described for adding one or more features (e.g., high bandwidth memory (HBM)) to a qualified stacked silicon interconnect (SSI) technology programmable integrated circuit (IC) region by providing an interface (e.g., an HBM buffer region implemented with a hierarchical switch network) between the added feature device and the programmable IC region. One example apparatus generally includes a programmable IC region and an interface region configured to couple the programmable IC region to at least one fixed feature die via a first plurality of ports associated with the at least one fixed feature die and a second plurality of ports associated with the programmable IC region. The interface region is configured as a switch network between the first plurality of ports and the second plurality of ports, and the switch network includes a plurality of full crossbar switch networks.
Public/Granted literature
- US20180358313A1 HIGH BANDWIDTH MEMORY (HBM) BANDWIDTH AGGREGATION SWITCH Public/Granted day:2018-12-13
Information query
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