Invention Grant
- Patent Title: Electrical binding structure and method of forming the same
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Application No.: US16390018Application Date: 2019-04-22
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Publication No.: US10916518B2Publication Date: 2021-02-09
- Inventor: Li-Yi Chen
- Applicant: MIKRO MESA TECHNOLOGY CO., LTD.
- Applicant Address: WS Apia
- Assignee: MIKRO MESA TECHNOLOGY CO., LTD.
- Current Assignee: MIKRO MESA TECHNOLOGY CO., LTD.
- Current Assignee Address: WS Apia
- Agency: CKC & Partners Co., LLC
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/495

Abstract:
An electrical binding structure is provided, which includes a substrate, a contact pad set, and a combination of a micro device and an electrode. The contact pad set is on the substrate in which the contact pad set includes at least one contact pad, and the at least one contact pad is conductive. The combination is on the contact pad set. Opposite sides of the electrode are respectively in contact with the micro device and the contact pad set in which at least the contact pad set and the electrode define at least one volume space. A vertical projection of the at least one volume space on the substrate is overlapped with a vertical projection of one of the contact pad set and the electrode on the substrate, and is enclosed by a vertical projection of an outer periphery of the micro device on the substrate.
Public/Granted literature
- US20200335464A1 ELECTRICAL BINDING STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2020-10-22
Information query
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