Invention Grant
- Patent Title: Manufacturing method of display substrate, array substrate and display device
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Application No.: US15777118Application Date: 2017-09-26
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Publication No.: US10916568B2Publication Date: 2021-02-09
- Inventor: Jun Liu , Ming Wang , Jun Wang , Bin Zhou
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing; CN Anhui
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing; CN Anhui
- Priority: CN201710203759 20170330
- International Application: PCT/CN2017/103454 WO 20170926
- International Announcement: WO2018/176766 WO 20181004
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L27/32

Abstract:
A manufacturing method of a display substrate, an array substrate and a display device are provided. The method includes forming a first wire, a first insulation layer, a first and second metal layer, and a photoresist layer; forming a photoresist retained pattern above the first wire; forming a second and first metal layer retained pattern under the photoresist retained pattern; forming a second insulation layer with a thickness less than or equal to a sum of thicknesses of the first and second metal layer; the second insulation layer forming a fracture region at a boundary between a part covering the first insulation layer and another part covering the second metal layer retained pattern; removing the first and second metal layer retained patterns by a wet etch process to expose the first insulation layer; and forming a contact hole exposing the first wire.
Public/Granted literature
- US20200312881A1 MANUFACTURING METHOD OF DISPLAY SUBSTRATE, ARRAY SUBSTRATE AND DISPLAY DEVICE Public/Granted day:2020-10-01
Information query
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