Invention Grant
- Patent Title: Array substrate and method for manufacturing array substrate
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Application No.: US16484509Application Date: 2018-11-19
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Publication No.: US10916609B2Publication Date: 2021-02-09
- Inventor: Yan Xie
- Applicant: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Hubei
- Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Hubei
- Agent Mark M. Friedman
- Priority: CN201811237408 20181023
- International Application: PCT/CN2018/116217 WO 20181119
- International Announcement: WO2020/082472 WO 20200430
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L27/32 ; H01L51/00 ; H01L29/66 ; H01L29/786

Abstract:
An array substrate and a method of manufacturing the same are provided. The array substrate sequentially includes a flexible substrate, a buffer layer, an active layer, a first gate insulating layer, a first gate metal layer, a second gate insulating layer, a second gate metal layer, an inter-insulating layer, a first organic filling layer, a source-drain wiring layer, a planarization layer, an anode layer, a pixel defining layer, and a supporting layer from bottom to top; the first organic filling layer is convex upward on the inter-insulating layer, making the source-drain wiring layer covering thereon disposed to be convex. The method of manufacturing the array, substrate is sequentially to manufacture the layers from bottom to top, wherein the convex first organic filling layer disposed on the inter-insulating layer of the array substrate is used to raise a drain thereon.
Information query
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