Invention Grant
- Patent Title: Array substrate and method for repairing array substrate
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Application No.: US16413040Application Date: 2019-05-15
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Publication No.: US10916618B2Publication Date: 2021-02-09
- Inventor: Minghua Xuan , Xiaochuan Chen , Han Yue , Ning Cong
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Dave Law Group LLC
- Agent Raj S. Dave
- Priority: CN201810803817 20180720
- Main IPC: H01L27/32
- IPC: H01L27/32 ; H01L27/12 ; H01L27/15 ; H01L51/56

Abstract:
The present disclosure relates to an array substrate and a method for repairing an array substrate. The array substrate includes: a plurality of sub-pixels located on a substrate, each sub-pixel including a driving transistor and a light emitting device, a control electrode of the driving transistor being coupled to a data signal terminal and a first electrode of the driving transistor being coupled to a first voltage terminal, the light emitting device being connected in series between a second electrode of the driving transistor and a second voltage terminal, the sub-pixels including a first sub-pixel and a second sub-pixel adjacent to the first sub-pixel that emits light of the same color as that of the first sub-pixel; and a first repairing line insulated from and intersecting with a connection line between the light emitting device and the second electrode of the driving transistor of the first sub-pixel and a connection line between the light emitting device and the second electrode of the driving transistor of the second sub-pixel.
Public/Granted literature
- US20200027944A1 Array Substrate And Method For Repairing Array Substrate Public/Granted day:2020-01-23
Information query
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