Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16281031Application Date: 2019-02-20
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Publication No.: US10916628B2Publication Date: 2021-02-09
- Inventor: Yosuke Sakurai , Yuichi Onozawa , Akio Nakagawa
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP2018-072792 20180404
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/06 ; H01L29/739 ; H01L29/08 ; H01L29/861 ; H01L29/10 ; H01L29/40

Abstract:
Provided is a semiconductor device including a drift region having a first conductivity type provided on a semiconductor substrate; a plurality of trench portions provided above the drift region, on a top surface side of the semiconductor substrate; a base region having a second conductivity type provided in a mesa portion sandwiched between the plurality of trench portions, in the semiconductor substrate; an emitter region having the first conductivity type provided above the base region, on a top surface of the mesa portion; and a contact region having the second conductivity type and a higher doping concentration than the base region, provided adjacent to the emitter region on the top surface of the mesa portion, wherein a mesa width of the mesa portion is less than or equal to 100 nm, and a bottom end of the contact region is shallower than a bottom end of the emitter region.
Public/Granted literature
- US20190312105A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-10-10
Information query
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