Invention Grant
- Patent Title: LED package using electroform stencil printing
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Application No.: US16901044Application Date: 2020-06-15
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Publication No.: US10916689B2Publication Date: 2021-02-09
- Inventor: Sridevi A. Vakkalanka , S. Rao Peddada
- Applicant: Lumileds LLC
- Applicant Address: US CA San Jose
- Assignee: Lumileds LLC
- Current Assignee: Lumileds LLC
- Current Assignee Address: US CA San Jose
- Agency: Volpe Koenig
- Priority: EP17161845 20170320
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/60 ; B23K31/02 ; H01L33/48 ; B23K3/06 ; B23K1/00

Abstract:
A light emitting device comprises a reflector cup coupled to a base that defines a cavity. The base comprises a plurality of metal pads exposed on a bottom surface of the cavity. The base further comprises a plurality of protrusions arranged around a perimeter of the base and disposed inside one or more side surfaces of the reflector cup. The light emitting device comprises an LED die disposed over the bottom surface of the cavity. The LED die is coupled to the metal pads with gold-tin solder. The LED die has a footprint that is at most 30% smaller than an area of a top opening of the cavity.
Public/Granted literature
- US20200313060A1 LED PACKAGE USING ELECTROFORM STENCIL PRINTING Public/Granted day:2020-10-01
Information query
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