Invention Grant
- Patent Title: Wireless module
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Application No.: US16230330Application Date: 2018-12-21
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Publication No.: US10916827B2Publication Date: 2021-02-09
- Inventor: Kimihiro Maruyama , Masakazu Muranaga , Masaru Sakurai , Tatsuya Kakehashi
- Applicant: FUJITSU COMPONENT LIMITED
- Applicant Address: JP Tokyo
- Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Staas & Halsey LLP
- Priority: JP2018-059016 20180326
- Main IPC: H01Q1/52
- IPC: H01Q1/52 ; H01Q1/12 ; H01Q1/42 ; H01Q21/06 ; H01Q9/04

Abstract:
A wireless module including: a substrate that includes a first surface and a second surface on the back side of the first surface; a plurality of signal terminals that are provided on the first surface and the second surface, input and output signals; an antenna provided on the first surface; a signal processing circuit that is provided on the second surface, is connected between the signal terminals and the antenna, and performs various signal processings on signals input from the signal terminals and the antenna; wherein the signal terminals are arranged in horizontal symmetry on the first surface and the second surface, arranged at the same positions of the first surface and the second surface, and connected to a single signal line in the substrate.
Public/Granted literature
- US20190296417A1 WIRELESS MODULE Public/Granted day:2019-09-26
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