Invention Grant
- Patent Title: Antenna structure with integrated coupling element and semiconductor package using the same
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Application No.: US16293661Application Date: 2019-03-06
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Publication No.: US10916854B2Publication Date: 2021-02-09
- Inventor: Jiunn-Nan Hwang , Yi-Chieh Lin , Yen-Ju Lu , Shih-Chia Chiu , Wen-Chou Wu
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/22 ; H01Q1/48 ; H01Q19/10 ; H01Q21/06 ; H01Q21/00 ; H01Q11/04 ; H01Q19/00 ; H01L23/498 ; H01L23/66 ; H05K1/02 ; H05K1/11 ; H05K1/18 ; H01L23/00 ; H05K1/03

Abstract:
An antenna structure includes a radiative antenna element disposed in a first conductive layer, a reflector ground plane disposed in a second conductive layer under the first conductive layer, a feeding network comprising a transmission line disposed in a third conductive layer under the second conductive layer, and at least one coupling element disposed in proximity to a feeding terminal that electrically couples one end of the transmission line to the radiative antenna element. The coupling element is capacitively coupled with the feeding terminal.
Public/Granted literature
- US20190305428A1 ANTENNA STRUCTURE WITH INTEGRATED COUPLING ELEMENT AND SEMICONDUCTOR PACKAGE USING THE SAME Public/Granted day:2019-10-03
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