Invention Grant
- Patent Title: Plate-like conductive member connection structure and plate-like conductive path
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Application No.: US16484498Application Date: 2018-01-22
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Publication No.: US10916872B2Publication Date: 2021-02-09
- Inventor: Hisashi Kojima , Yasuo Omori , Shunya Takeuchi
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Mie; JP Mie; JP Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Mie; JP Mie; JP Osaka
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2017-022928 20170210
- International Application: PCT/JP2018/001756 WO 20180122
- International Announcement: WO2018/147055 WO 20180816
- Main IPC: H01R13/04
- IPC: H01R13/04 ; H01R4/62 ; H01R9/22 ; H01R11/01 ; H01R13/03 ; H01R13/11

Abstract:
It is aimed to provide a plate-like conductive member connection structure and a plate-like conductive path capable of reducing the number of connecting components. A plurality of plate-like conductive members (11) having conductivity and insulating members (13) configured to cover the plate-like conductive members (11) are provided, and the plurality of plate-like conductive members (11) are connected to each other by terminal portions (12) respectively provided on the plate-like conductive members (11). According to this configuration, since the plate-like conductive members (11) can be connected without using a connecting component such as a wire, the number of connecting components can be reduced.
Public/Granted literature
- US20200006881A1 PLATE-LIKE CONDUCTIVE MEMBER CONNECTION STRUCTURE AND PLATE-LIKE CONDUCTIVE PATH Public/Granted day:2020-01-02
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