A method of manufacturing a light emitting device includes: providing a first support member having an outer circumferential lateral surface and a first through-hole penetrating from an upper surface to a lower surface; disposing a light-transmissive member containing a fluorescent material in the first through-hole; providing a second support member having an inner circumferential lateral surface and a second through-hole penetrating from an upper surface to a lower surface, an inner dimension of the second support member being smaller than an outer dimension of the first support member at room temperature; and performing shrink fitting, which comprises heating the first support member and the second support member to increase the inner dimension of the second support member to be greater than the outer dimension of the first support member, thereafter disposing the first support member in the second support member.