- Patent Title: Power module, power module assembly and assembling method thereof
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Application No.: US15952554Application Date: 2018-04-13
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Publication No.: US10917999B2Publication Date: 2021-02-09
- Inventor: Zhenrong Huang , Peiai You , Hao Sun
- Applicant: Delta Electronics (Thailand) Public Company Limited
- Applicant Address: TH Samutprakarn
- Assignee: Delta Electronics (Thailand) Public Company Limited
- Current Assignee: Delta Electronics (Thailand) Public Company Limited
- Current Assignee Address: TH Samutprakarn
- Agency: Kirton McConkie
- Agent Evan R. Witt
- Priority: CN201710379283 20170525,CN201810054682 20180119
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/02 ; H05K1/18 ; H05K5/00 ; H01L25/00 ; H01L25/11 ; H01L23/473 ; H01L23/40 ; H01L23/367 ; H01L25/07 ; H01L25/18 ; H02M7/00

Abstract:
The present disclosure provides a power module, a power module assembly and an assembling method thereof. The power module assembly includes a housing, a resilient bracket, a circuit board, a power device and a fastening unit. The housing includes a first heat-dissipation surface. The resilient bracket is pre-fastened on the housing. The resilient bracket is located near the first heat-dissipation surface and configured with the first heat-dissipation surface to form an accommodating space. The circuit board is configured to assemble on the housing. The power device is plugged in the circuit board and accommodated in the accommodating space. The fastening unit is pre-fastened on the housing and pressing the resilient bracket. While the resilient bracket pushes against the power device, the power device is attached to the first heat-dissipation surface.
Public/Granted literature
- US20180343775A1 POWER MODULE, POWER MODULE ASSEMBLY AND ASSEMBLING METHOD THEREOF Public/Granted day:2018-11-29
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