Invention Grant
- Patent Title: Component placing method
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Application No.: US16121188Application Date: 2018-09-04
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Publication No.: US10918001B2Publication Date: 2021-02-09
- Inventor: Daisuke Furukawa , Koichi Obayashi , Seiichi Matsuo
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2017-183141 20170925
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K13/08 ; H05K13/04

Abstract:
A component placing device to place a component on a board, including: a shaft having a lower portion and an upper portion; a component holder that is attached to the lower portion of the shaft in a state of being vertically displaceable and has a suction hole for holding the component by a negative pressure; an elastic body that biases the component holder downward with respect to the shaft; a servo motor that raises and lowers the shaft; and a controller that sets a thrust limit value for limiting a thrust of the servo motor and limits the thrust of the servo motor to be equal to or lower than the thrust limit value when the component holder is lowered toward the board. The thrust limit value is set within a range in which a load is smaller than a force by which the elastic body biases the component holder.
Public/Granted literature
- US20190098810A1 COMPONENT PLACING DEVICE AND COMPONENT PLACING METHOD Public/Granted day:2019-03-28
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