An in-mold electronics package includes a printed circuit board (PCB) having a first side and a second side, the PCB defining an opening, a light emitting diode (LED) disposed on the second side adjacent the opening, a light guide disposed on the second side of the PCB and partially disposed within the opening, a film disposed on the first side of the PCB, and a cover disposed over the film, the cover connected to the light guide, and wherein the cover and the light guide cooperate to form at least one sealed perimeter wall of the in-mold electronics package.