The structure and the testing device used for measuring the bonding strength of the light-emitting panel, including: a substrate, a flip chip film is disposed on the substrate, and a bonding portion of the flip chip film is bonded to the substrate. Wherein an orthographic projection of a non-bonding portion of the flip chip film on the substrate covers an orthographic projection of the bonding portion on the substrate, and the non-bonding portion is stretched to measure a bonding strength between the flip chip film and the substrate, thereby reducing the risk of breakage between the layers inside the substrate, thereby the bonding strength between the flip chip film and the substrate can be measured more accurately.