A method of making an electronics enclosure that is light-weight, structurally sound and EMI resistant is provided. Preferably the electronics enclosure is made by covering the walls of a mold for the chassis and the lid with a metallic mesh. At least two plies of carbon prepreg are applied over the metallic mesh. The carbon prepreg and metallic mesh are then cured together at high temperature, typically in an autoclave. The wire mesh becomes integrated into the composite material during the curing process when the carbon material shrinks to the mold and the epoxy bonds with the wire mesh. The molds may then be removed leaving an electronics enclosure with superior properties.