An LED display module contains a PCB, one or more layers of molding compound disposed on the surface of the PCB, a network of conductive tracks disposed on a surface of the one or more layer of molding compound away from the PCB, a plurality of through-holes extending through the one or more layers of molding compound, and an array of LED chips disposed in the one or more layers of molding compound. Each of electrodes on the LED chip is connected to one of the conductive pads via a conductive path. The conductive path comprises a conductive material inside one of the plurality of the through-holes and a portion of the network of conductive tracks.