Invention Grant
- Patent Title: Gas spraying apparatus for substrate processing apparatus and substrate processing apparatus
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Application No.: US16322925Application Date: 2017-08-24
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Publication No.: US10923326B2Publication Date: 2021-02-16
- Inventor: Sung Bae Kim , Cheong Son
- Applicant: JUSUNG ENGINEERING CO., LTD.
- Applicant Address: KR Gwangju-si
- Assignee: JUSUNG ENGINEERING CO., LTD.
- Current Assignee: JUSUNG ENGINEERING CO., LTD.
- Current Assignee Address: KR Gwangju-si
- Agency: Renaissance IP Law Group LLP
- Priority: KR10-2016-0114515 20160906
- International Application: PCT/KR2017/009247 WO 20170824
- International Announcement: WO2018/048125 WO 20180315
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H05H1/46 ; C23C16/455 ; C23C16/50 ; H01L21/687

Abstract:
The present disclosure relates to a gas distribution apparatus for substrate processing apparatuses, including: a distribution body distributing a process gas toward a substrate supporting unit supporting a substrate; a first injection hole provided in the distribution body, a process gas which is to be distributed toward the substrate supporting unit being injected through the first inject hole; and a second injection hole provided in the distribution body at a position spaced apart from the first injection hole, a process gas which is to be distributed toward the substrate supporting unit being injected through the second inject hole, and a substrate processing apparatus.
Public/Granted literature
- US20190157038A1 GAS SPRAYING APPARATUS FOR SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2019-05-23
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