- Patent Title: Inspection method, inspection device, and marking forming method
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Application No.: US16742382Application Date: 2020-01-14
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Publication No.: US10923404B2Publication Date: 2021-02-16
- Inventor: Shinsuke Suzuki , Akira Shimase
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JP2017-007383 20170119
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01R31/28 ; H01L21/268 ; H01L21/67 ; H01L23/544
Abstract:
An inspection method according to an embodiment is an inspection method of performing laser marking on a semiconductor device (D) including a substrate (SiE) and a metal layer (ME) formed on the substrate (SiE), and the inspection method includes specifying a fault point (fp) in the semiconductor device (D) by inspecting the semiconductor device (D), and irradiating the semiconductor device (D) with laser light having a wavelength that is transmitted through the substrate (SiE) from the substrate (SiE) side so that a marking is formed at least at a boundary between the substrate (SiE) and the metal layer (ME) on the basis of the fault point (fp).
Public/Granted literature
- US20200152525A1 INSPECTION METHOD, INSPECTION DEVICE, AND MARKING FORMING METHOD Public/Granted day:2020-05-14
Information query
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