Invention Grant
- Patent Title: Bonds for solar cell metallization
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Application No.: US16813258Application Date: 2020-03-09
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Publication No.: US10923616B2Publication Date: 2021-02-16
- Inventor: Richard Hamilton Sewell , Michel Arsène Olivier Ngamo Toko , Matthieu Moors , Jens Dirk Moschner
- Applicant: SunPower Corporation , Total Marketing Services
- Applicant Address: US CA San Jose; FR Puteaux
- Assignee: SunPower Corporation,Total Marketing Services
- Current Assignee: SunPower Corporation,Total Marketing Services
- Current Assignee Address: US CA San Jose; FR Puteaux
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L31/0224 ; B32B37/06 ; B32B38/00
Abstract:
A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.
Public/Granted literature
- US20200212248A1 BONDS FOR SOLAR CELL METALLIZATION Public/Granted day:2020-07-02
Information query
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