Invention Grant
- Patent Title: Package, light emitting device, and method of manufacturing the package
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Application No.: US16449445Application Date: 2019-06-24
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Publication No.: US10923643B2Publication Date: 2021-02-16
- Inventor: Yuki Shiota
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Mori & Ward, LLP
- Priority: JPJP2018-120209 20180625
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/60 ; H01L33/64 ; H01L33/50

Abstract:
A package includes a first lead including a first electrode terminal, and a second lead including a second electrode terminal and provided on the first lead in an overlapping direction such that the first electrode terminal of the first lead overlaps with the second electrode terminal of the second lead when viewed in the overlapping direction. The first electrode terminal and the second electrode terminal are electrically connected to each other without adding additional material.
Public/Granted literature
- US20190393390A1 PACKAGE, LIGHT EMITTING DEVICE, AND METHOD OF MANUFACTURING THE PACKAGE Public/Granted day:2019-12-26
Information query
IPC分类: